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FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

Product Details

Place of Origin: Guangdong, China

Brand Name: YUSH

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: $4,000 / set

Get Best Price

Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                FPC to PCB soldering machine, high-precision thermal bonding equipment, PCB depaneling welding machine
                              

Weight:	110 Kg	Power:	10 KW
Voltage:	220V/110V	Model:	YSPP-1A
Size:	500mm X 750mm X 910mm	Work Air Pressure:	0.5-0.7MPA
Working Area:	110mm X 150mm	Temperature Range:	0-400℃
Temperature Tolerance:	+2℃	Pressing Time:	0-99s
Pressing Tolerance:	0.05MPA	Bonding Force:	3,900N
Heat Seal Pitch:	0.25mm	Core Components:	PLC, Gearbox, Motor, Pump
Cycle Time:	Extremely Short

Weight:	110 Kg
Power:	10 KW
Voltage:	220V/110V
Model:	YSPP-1A
Size:	500mm X 750mm X 910mm
Work Air Pressure:	0.5-0.7MPA
Working Area:	110mm X 150mm
Temperature Range:	0-400℃
Temperature Tolerance:	+2℃
Pressing Time:	0-99s
Pressing Tolerance:	0.05MPA
Bonding Force:	3,900N
Heat Seal Pitch:	0.25mm
Core Components:	PLC, Gearbox, Motor, Pump
Cycle Time:	Extremely Short

FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

FPC to PCB Board Pulse-Heated Soldering/Welding Machine

High-precision thermal bonding equipment designed for precision soldering applications requiring controlled thermal management.

Technology Overview

Hot bar soldering is highly effective for bonding dissimilar components that are difficult to unite using traditional methods. This pulse bonding technology utilizes thermode-based rapid reflow through pulse heating, enabling materials with low temperature resistance to be soldered at high lead-free temperatures without damaging flexible circuits. The process selectively heats components to melt adhesive or solder, which then re-solidifies to form permanent, reliable bonds.

Key Features

Extremely short cycle time with rotary table design allowing product loading/unloading during heat sealing process
High quality heat seal application for pitches up to 0.25mm
Pneumatic bonding head delivering up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Bonding cycle triggered by real-time pressure sensor
Floating thermode ensuring consistent pressure and heat transfer along flexfoil to LCD and/or PCB
Precision product fixtures (2X) with micrometer alignment and vacuum component fixation
Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
Full microprocessor logic control system

Technical Specifications

Model	YSPP-1A
Size	500mm × 750mm × 910mm
Work Air Pressure	0.5-0.7 MPA
Working Area	110mm × 150mm
Temperature Setup	0-400℃
Tolerance of Temperature	+2℃
Time of Pressing	0-99s
Tolerance of Pressing	0.05 MPA

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FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

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