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Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Product Details

Place of Origin: Jiangsu, China

Brand Name: YUSH

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: $8,000 / set

Get Best Price

Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                Pulse-heated soldering machine for FPC, High-precision PCB welding equipment, Pulse heat welding for board assembly
                              

Weight:	110 KG	Working Area:	110mm X 150mm
Temperature Tolerance:	+2℃	Work Air Pressure:	0.5-0.7Mpa
Model:	YSPP-1A	Size:	500mm X 750mm X 910mm
Temperature Range:	0-400℃	Pressing Time:	0-99s
Pressing Tolerance:	0.05MPA	Bonding Force:	3,900N
Pitch Capability:	0.25mm	Core Components:	Motor
Pressure Control:	Digital Programmable	Temperature Control:	Closed Loop PID
Alignment Module:	Optional CCD

Weight:	110 KG
Working Area:	110mm X 150mm
Temperature Tolerance:	+2℃
Work Air Pressure:	0.5-0.7Mpa
Model:	YSPP-1A
Size:	500mm X 750mm X 910mm
Temperature Range:	0-400℃
Pressing Time:	0-99s
Pressing Tolerance:	0.05MPA
Bonding Force:	3,900N
Pitch Capability:	0.25mm
Core Components:	Motor
Pressure Control:	Digital Programmable
Temperature Control:	Closed Loop PID
Alignment Module:	Optional CCD

Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Pulse-Heated Soldering Machine for FPC to PCB Board

High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.

Model Specifications: YSPP-1A

Accurate tin press without dragging
Precise temperature control
Fine-pitch positioning capability
Digital program pressure control

Advanced Features

Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provides up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Real-time pressure sensor triggered bonding cycle
Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
Full microprocessor logic control for reliable operation

Technical Parameters

Parameter	Specification
Model	YSPP-1A
Size	500mm × 750mm × 910mm
Work Air Pressure	0.5-0.7 MPA
Working Area	110mm × 150mm
Temperature Setup	0-400℃
Tolerance of Temperature	+2℃
Time of Pressing	0-99s
Tolerance of Pressing	0.05 MPA

Technology Overview

Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.

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Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly