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High Quality Industrial X-Ray Microfocus CT Equipment YS-8500

Product Details

Place of Origin: Guangdong, China

Brand Name: YUSH

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: $35,000 / set

Get Best Price

Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                Industrial X-Ray CT equipment, Microfocus CT equipment YS-8500, PCB depaneling X-Ray machine
                              

Voltage:	160KV	Power:	64W
Weight:	2800	Dimensions:	1500mm 1650mm 2250mm
Defect Resolution:	1 μm	Geometric Magnification:	2000 Times
Scanning Mode:	360°	Motion Mechanism:	8-axis
CT Function:	Planar CT (PCT)	CT Function:	Cone Beam CT
Image Enhancement:	Automatic Gray Distribution	Core Components:	Engine, Bearing, Gearbox, Motor, Pressure Vessel, Gear
X-ray Tube:	COMET Open Design	Transmission Target:	Minimum FOD
Inspection Capability:	Micro-scale Features

Voltage:	160KV
Power:	64W
Weight:	2800
Dimensions:	1500mm 1650mm 2250mm
Defect Resolution:	1 μm
Geometric Magnification:	2000 Times
Scanning Mode:	360°
Motion Mechanism:	8-axis
CT Function:	Planar CT (PCT)
CT Function:	Cone Beam CT
Image Enhancement:	Automatic Gray Distribution
Core Components:	Engine, Bearing, Gearbox, Motor, Pressure Vessel, Gear
X-ray Tube:	COMET Open Design
Transmission Target:	Minimum FOD
Inspection Capability:	Micro-scale Features

High Quality Industrial X-Ray Microfocus CT Equipment YS-8500

The YS-8500 universal industrial X-ray inspection system comprises an X-ray source, detector, scanning system, and image reconstruction and analysis system. This advanced equipment supports multiple inspection methods including 2D, 3D, and CT scanning, making it ideal for quality inspection, 3D measurement, and non-destructive analysis applications.

Key Applications

SMT surface packaging components: PoP, BGA, QFN, QFP, DIP, IC inspection
Semiconductor inspection including TSV, Flip chip, Copper Pillar analysis
Micro chip and low-density material inspection
Sensors, relays, fuses, micro motors (MEMS, MOEMS), cables and plugs
Various materials including plastic, ceramics, optical components, small titanium and aluminum castings
Electronic component soldering quality inspection for BGA components, integrated circuits, and bonding wires
Detection of soldering abnormalities including missing parts, deviation, tin connection, contamination, faulty soldering, component foot warping, voids, and pillow effect

Performance Features and Advantages

COMET open X-ray tube design with defect inspection capability reaching 1 μm
Transmission target with minimum FOD and geometric magnification exceeding 2000×
Highest defect resolution for precise analysis
360° scanning mode with proprietary technology for fixed-point defect observation
8-axis motion mechanism enabling sample analysis from any angle
Unique tracking technology maintains detected point at image center during detector tilt or rotation
Planar CT function (PCT) for 3D/CT inspection of printed circuit boards, SMTs, IGBTs, and wafers
Cone beam CT function for sensors, relays, micro motors, materials, and aluminum casting inspection
Rapid CT scanning and reconstruction to meet daily analysis requirements
MES module for seamless integration with Industry 4.0 information management systems
Image enhancement technology automatically optimizes gray distribution for superior black and white contrast