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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                high efficiency wave soldering machine, selective wave soldering machine SMT, PCB depaneling wave soldering machine
                              

Weight:	12 KG	Voltage:	220V
PCB Size:	50×50～320×250 Mm	PCB Thickness:	0.8～3 Mm
Pin Length:	3mm Within	Component Height:	Less Than 100mm
Substrate Edge:	More Than 3mm	Substrate Weight:	5KG Max
Substrate Bending:	Less Than 0.5mm	Tin Furnace Material:	All-titanium Alloy
Tin Furnace Capacity:	12KG	Tin Furnace Power:	4*500W, 2KW
Preheating Power:	1KW	Preheating Type:	Infrared
Core Components:	PLC, Engine, Bearing, Gearbox, Motor

Weight:	12 KG
Voltage:	220V
PCB Size:	50×50～320×250 Mm
PCB Thickness:	0.8～3 Mm
Pin Length:	3mm Within
Component Height:	Less Than 100mm
Substrate Edge:	More Than 3mm
Substrate Weight:	5KG Max
Substrate Bending:	Less Than 0.5mm
Tin Furnace Material:	All-titanium Alloy
Tin Furnace Capacity:	12KG
Tin Furnace Power:	4*500W, 2KW
Preheating Power:	1KW
Preheating Type:	Infrared
Core Components:	PLC, Engine, Bearing, Gearbox, Motor

YS-320Y/YS-320YT High Efficiency Integrated Selective Wave Soldering Machine for SMT Production Line

YS-320Y/YS-320YT High Efficiency Integrated Selective Wave Soldering Machine

Designed for SMT production lines, this integrated selective wave soldering machine delivers exceptional efficiency and precision for PCB assembly applications.

Technical Specifications

Applicable PCB Board Size	L × W: 50×50 mm to 320×250 mm
Applicable PCB Board Thickness	Substrate thickness: 0.8–3 mm / Pin length: within 3mm
Component Height	Less than 100mm above substrate / Less than 50mm below substrate
Substrate Shape and Conditions	Substrate placement edge: more than 3mm from substrate process edge Maximum weight including components: 5KG Substrate bending: less than 0.5mm

Packaging & Delivery

We provide professional, environmentally friendly, convenient and efficient packaging services to ensure the complete safety of your goods during transit.