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Home > Products > PCB Depaneling Machine > Desktop Selective Wave Soldering YS-E320

Desktop Selective Wave Soldering YS-E320

Product Details

Place of Origin: Guangdong, China

Brand Name: YUSH

Model Number: YS-E320

Payment & Shipping Terms

Minimum Order Quantity: 1 kilometer

Price: $5,000 / kilometer

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Desktop selective wave soldering machine

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YS-E320 wave soldering system

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PCB depaneling soldering equipment

Weight:
70 KG
External Dimensions:
730×800×840 Mm
PCB Board Size:
50×50~450×400 Mm
PCB Board Thickness:
0.8~3 Mm
Component Height:
Less Than 100mm Above / 50mm Below
Substrate Weight:
Less Than 5 Kilograms
Substrate Bending:
Less Than 0.5mm
Tin Furnace Capacity:
10KG
Tin Furnace Power:
2 KW
Nitrogen Purity:
99.999%
Nitrogen Consumption:
1.2-1.5 Cube H
Flux Capacity:
2 L
Nozzle Inner Diameter:
φ 3mm~φ 20mm
Power Supply:
Single-phase 220V±10%
Starting Power:
2.5KW
Weight:
70 KG
External Dimensions:
730×800×840 Mm
PCB Board Size:
50×50~450×400 Mm
PCB Board Thickness:
0.8~3 Mm
Component Height:
Less Than 100mm Above / 50mm Below
Substrate Weight:
Less Than 5 Kilograms
Substrate Bending:
Less Than 0.5mm
Tin Furnace Capacity:
10KG
Tin Furnace Power:
2 KW
Nitrogen Purity:
99.999%
Nitrogen Consumption:
1.2-1.5 Cube H
Flux Capacity:
2 L
Nozzle Inner Diameter:
φ 3mm~φ 20mm
Power Supply:
Single-phase 220V±10%
Starting Power:
2.5KW
Desktop Selective Wave Soldering YS-E320
Desktop Selective Wave Soldering YS-E320
Solve DIP Welding Challenges
The YS-E320 addresses common difficulties in DIP welding with advanced selective wave soldering technology.
Key Advantages
  • Flexible production for multiple varieties and small batches
  • Quick online welding without fixtures required
  • Extremely low equipment purchase cost
  • Reduced usage and maintenance costs
  • 100% tin penetration rate with over 98% welding yield
  • Minimal floor space requirement (approximately 1 square meter)
Selective Wave Soldering Working Mode
During offline selective welding, the welding nozzle remains fixed while the PCB board moves according to programmed instructions along X, Y, and Z axes to achieve precise soldering of PCB solder joints.
Technical Specifications
Specification Item YS-E320
Applicable PCB Board Size L×W: 50×50~450×400 mm
Applicable PCB Board Thickness Substrate thickness: 0.8~3 mm / Pin length: Within 3mm
Component Height Less than 100mm above substrate / Less than 50mm below substrate
Substrate Shape and Conditions Substrate placement edge: ≥3mm process edge / Weight including components: <5kg / Substrate bending: <0.5mm
Tin Furnace Material: Stainless steel / Capacity: 10KG / Power: 4×500W (2KW total)
N2 Requirements Purity: 99.999% / Pressure: 0.5MPa / Consumption: 20-30L/min (1.2-1.5 m³/h)
Flux Nozzle Precision fluid nozzle
Flux Capacity 2L (Manual liquid addition)
Gas Source 0.5-0.7MPa
Nozzle Inner Diameter φ3mm~φ20mm (Customizable sizes available)
Peak Height Automatic alignment and height measurement
System Control PC + PLC (Windows + Huichuan)
Programming Software Supports programming with picture line drawing (Convenient and fast)
Power Supply/Power Single-phase 220V±10% / Starting power: 2.5KW
Weight 70KG (Including 10KG solder)
External Dimensions L×W×H: 730×800×840 mm