Name: Automatic BGA Rework Station YS-800
Brand: YUSH Electronic Technology Co.,Ltd
SKU: YS-800
Price: 254.00 USD
Availability: InStock

Product Details

Place of Origin: Guangdong, China

Brand Name: YUSH

Certification: CE

Model Number: YS-800

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: $8,500 / set

Get Best Price

Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                Automatic BGA Rework Station, YS-800 PCB Depaneling Machine, BGA Rework Station with warranty
                              

Weight:	140kg	Voltage:	220V
Power Supply:	220V,50/60Hz	Max PCB Size:	W650*D610mm
PCB Thickness:	0.5-8mm	BGA Size:	11-8080mm
Min Ball Pitch:	0.15mm	Max BGA Weight:	1000g
Placement Precision:	±0.01mm	Lower Heating Power:	1200W
Upper Heating Power:	1200W	Bottom Pre-heating:	IR5000W
Machine Dimension:	L970W700H830mm	Temperature Range:	50-80°C
Heating Speed:	10°C Per Minute

Weight:	140kg
Voltage:	220V
Power Supply:	220V,50/60Hz
Max PCB Size:	W650*D610mm
PCB Thickness:	0.5-8mm
BGA Size:	11-8080mm
Min Ball Pitch:	0.15mm
Max BGA Weight:	1000g
Placement Precision:	±0.01mm
Lower Heating Power:	1200W
Upper Heating Power:	1200W
Bottom Pre-heating:	IR5000W
Machine Dimension:	L970W700H830mm
Temperature Range:	50-80°C
Heating Speed:	10°C Per Minute

Automatic BGA Rework Station YS-800

Professional BGA rework station with integrated hot air head and mounting head design, featuring automatic soldering and desoldering functions for precision PCB repair.

Key Features & Specifications

Integrated hot air head and mounting head design with automatic soldering/desoldering
Upper heaters with hot air system: faster heating, even temperature distribution, rapid cooling (50-80°C)
Lower heaters with hot air & IR mixed heating: 10°C per minute heating speed
Three independent heaters with synchronous automatic movement
High-precision slider for accurate BGA and PCB mounting
German-imported bottom preheating table with 500×420mm heating area
Motor-controlled X/Y axis movement for precise alignment
Maximum PCB size: 650×610mm with no repair dead corners
Built-in vacuum pump with 360° rotation and fine-adjusting suction nozzle
Automatic BGA pickup and mounting height detection with pressure control
High-resolution color optical vision system with 22x optical zoom
10-segment temperature control with parameter curve analysis
Multiple alloy nozzle sizes with all-angle positioning
5 thermocouple ports for real-time multi-point temperature monitoring
Automatic SMT standard temperature curve generation

Technical Parameters

Parameter	Specification
Max PCB Size	W650 × D610mm
PCB Thickness	0.5-8mm
BGA Size	1×1 - 80×80mm
Min. Ball Pitch	0.15mm
Max Weight of BGA	1000g
Placement Precision	±0.01mm
PCB Locating Way	Outer or location hole
Temperature Control	K-type thermocouple, close loop control
Lower Heating Power	Hot air 1200W
Upper Heating Power	Hot air 1200W
Bottom Pre-heating	IR 5000W
Power Supply	220V, 50/60Hz (Double Phase)
Machine Dimension	L970 × W700 × H830mm (without frame)
Machine Weight	140kg