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Home > Products > PCB Depaneling Machine > YS-0307 SMT Solder Paste Environmental Friendly High Temperature Solder Paste for a Long Time Without Drying Solder Paste

YS-0307 SMT Solder Paste Environmental Friendly High Temperature Solder Paste for a Long Time Without Drying Solder Paste

Product Details

Place of Origin: Jiangsu, China

Brand Name: YUSH

Model Number: YS-0307

Payment & Shipping Terms

Minimum Order Quantity: 5 pieces

Price: $65-80 / piece

Get Best Price
Highlight:

SMT solder paste high temperature

,

environmental friendly solder paste

,

long-lasting solder paste PCB

Weight:
0.5 KG
Graininess:
22-38(um)
Viscosity:
200 (Pa*S)
Activity:
High Activity
Fusing Point:
218
Alloy Component:
Tin Silver Copper Alloy
Cleaning Angle:
90
Operating Temperature:
225-260(℃)
Storage Temperature:
5-10C
Storage Duration:
6 Months
Opened Storage Duration:
5 Days
Core Components:
Tin Silver Copper Alloy
Solder Joints:
Bright, Full, Free Of Beads
Residue Level:
Less Residue After Welding
Insulation Resistance:
High
Weight:
0.5 KG
Graininess:
22-38(um)
Viscosity:
200 (Pa*S)
Activity:
High Activity
Fusing Point:
218
Alloy Component:
Tin Silver Copper Alloy
Cleaning Angle:
90
Operating Temperature:
225-260(℃)
Storage Temperature:
5-10C
Storage Duration:
6 Months
Opened Storage Duration:
5 Days
Core Components:
Tin Silver Copper Alloy
Solder Joints:
Bright, Full, Free Of Beads
Residue Level:
Less Residue After Welding
Insulation Resistance:
High
YS-0307 SMT Solder Paste Environmental Friendly High Temperature Solder Paste for a Long Time Without Drying Solder Paste
YS-0307 SMT Solder Paste Environmental Friendly High Temperature Solder Paste for a Long Time Without Drying Solder Paste
Storage Guidelines
Proper storage ensures optimal performance and longevity of the solder paste:
  • Storage Temperature & Duration: Store in sealed environment at 5-10°C with 6-month shelf life. Follow first-in-first-out principle.
  • Opened Container Storage: Return unused paste to clean, contamination-free bottle and store separately in refrigeration. Do not mix with new solder paste. Use within 5 days after opening.
  • Reviving Dried Paste: If paste appears dry, add small amount of solder paste thinner and mix thoroughly before use.
Key Features
  • Bright, full solder joints with moderate viscosity and no bead formation
  • Minimal residue after welding with high insulation resistance - non-corrosive to PCB and suitable for no-clean applications
  • Extended continuous printing time with minimal slump hours after printing and stable viscosity for reduced component shifting
  • Excellent wettability and superior welding performance with reliable ICT test results
Technical Specifications
Graininess 22-38 (um)
Viscosity 200 (Pa*S)
Activity High activity
Fusing Point 218°C
Alloy Component Tin silver copper alloy
Cleaning Angle 90°
Operating Temperature 225-260°C