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Home > products > PCB Solder Paste Printer > High Precision Fully Automatic PCB Board Solder Paste Printer

High Precision Fully Automatic PCB Board Solder Paste Printer

Product Details

Place of Origin: jiangsu

Brand Name: Yushunli

Certification: CE, RUV Rheinland (China), GMC(GlobalMarket),ISO9001-2000

Model Number: G9+

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: USD 10400~89900

Packaging Details: Plywooden case

Delivery Time: 3 days to 7 days

Payment Terms: T/T ,Paypal ,West Union ,L/C ,D/P .

Supply Ability: 300 sets/ month

Get Best Price
Highlight:

PCB Board Solder Paste Printer

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High Precision pcb solder paste printer

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Fully Automatic pcb solder paste printer

Maximum Board Size:
450*340mm
Minimum Board Size:
50*50mm
Power Source:
AC:220±10%,50/60HZ,2.5KW
Machine Dimension(Without Tower Light):
1530(H)mm
Machine Length:
1172(L)mm
Machine Width:
1385(W)mm
Machine Weight Approx::
Approx:1000Kg
Operating Humidity:
30%~60%
Air Pressure:
4~6Kgf/cm²
Board Thickness:
0.4~6mm
Operating Temperature:
-20℃~+45℃
Air Consumption:
About 5L/min
Maximum Board Size:
450*340mm
Minimum Board Size:
50*50mm
Power Source:
AC:220±10%,50/60HZ,2.5KW
Machine Dimension(Without Tower Light):
1530(H)mm
Machine Length:
1172(L)mm
Machine Width:
1385(W)mm
Machine Weight Approx::
Approx:1000Kg
Operating Humidity:
30%~60%
Air Pressure:
4~6Kgf/cm²
Board Thickness:
0.4~6mm
Operating Temperature:
-20℃~+45℃
Air Consumption:
About 5L/min
High Precision Fully Automatic PCB Board Solder Paste Printer

High Precision And High Speed Fully Automatic Solder Paste Printer

The G9+automatic tin paste printing press is a high-end model for SMT high-end application, which can satisfy the printing process requirements of 03015, 0.25 pitch, high precision and high speed.

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Technical Parameter/Specifications

Substrate processing G9+
Maximum board size 450*340mm
Minimum board size 50*50mm
Board thickness 0.4~6mm
Maximum board weight 3Kg
Board edge clearance 2.5mm
Board height 15mm
Transport height 900±40mm
Transport Speed

1500mm/s(Max)

Program Control

Transport direction One stage
Board clamp Patented over the top clamping
Side clamping
Adsorption function
Support System Magnetic Pin
Support Block
Manual up-down table

 

 

Machine Parameter G9+
Power Source AC:220±10%,50/60HZ,2.5KW
Air Pressure 4~6Kgf/cm²
Air Consumption About 5L/min
Operating Temperature -20℃~+45℃
Operating Humidity 30%~60%
Machine Dimension(Without Tower light) 1530(H)mm
Machine Length 1172(L)mm
Machine Width 1385(W)mm
Machine Weight Approx: Approx:1000Kg

 

 

Dimensional Appearance

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BTB Dimensional Appearance

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Performance

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CCD digita| camera system

Total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mark point can be easily recognize (including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of differentPCB color.

 

 

 

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Highly precise PCBthickness adjustmenttable

Extremely reliable structure with stable XY movement. Manual adjustment makes it a breeze to accommodate different PCB thickness.

 

 

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Guide Rail positioning System

New pattern patented guide rail can detachable, programmable flexible side clamp, specific to FPC, PCBwarpage, perform a unique camping plate device. Through software programming can automatically stretch out and draw back unaffected PCB thickness.

 

 

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Innovative squeegee structure design

Adopt a comprehensive squeegee system which enhances stability and shelf-life.

 

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High speed stencil cleaning

Downward dispensing cleaning structure successfully prevents clogged opening (which is always the root cause for ineffective cleaning) from taking place. The length of solvent dispensed can also be easily amended with software control.

 

 

 

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New multi-function interface

Simplicity, Clearty understand, friendly user.
Actual temperature and humidity monitor function.

 

 

 

 

Option 4.0

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