Product Details
Place of Origin: Jiangsu
Brand Name: Yushunli
Certification: CE, RUV Rheinland (China), GMC(GlobalMarket),ISO9001-2000
Model Number: YSL-P
Payment & Shipping Terms
Minimum Order Quantity: 1 SET
Price: USD 12800~22800
Packaging Details: Plywooden case
Delivery Time: 3 days to 7days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 300 sets/ month
Printing Accuracy: |
≥2 Cpk@±25μm@,6σ |
Repeat Position Accuracy: |
≥2 Cpk@±10μm@,6σ |
Cycle Time: |
7s |
Maximum Print Area: |
400mm(X)x340mm(Y) |
Screen Frame Size: |
470mmx370mm~737mmx737mm |
Print Speed: |
1mm/sec-200mm/sec |
Printing Accuracy: |
≥2 Cpk@±25μm@,6σ |
Repeat Position Accuracy: |
≥2 Cpk@±10μm@,6σ |
Cycle Time: |
7s |
Maximum Print Area: |
400mm(X)x340mm(Y) |
Screen Frame Size: |
470mmx370mm~737mmx737mm |
Print Speed: |
1mm/sec-200mm/sec |
High Speed High Precision Inline/Offline PCB Solder Paste Printer 400mm(X)X340mm(Y)
Product technical parameters
制程参数Process Parameters 规格Specification | ||
印刷精度Printing Accuracy | ≥2 Cpk@±25μm@,6σ | |
重复定位精度Repeat Position Accuracy | ≥2 Cpk@±10μm@,6σ | |
循环时间Cycle Time | 7s | |
最大可印刷面积Maximum Print Area | 400mm(X)x340mm(Y) | |
网框尺寸Screen Frame Size | 470mmx×370mm~737mmx737mm | |
网框厚度Screen Frame Thickness | 20mm-40mm | |
刮刀压力Print Pressure | Okg -10kg | |
印刷速度Print Speed | 1mm/sec-200mm/sec | |
印刷间隙Print Gap | 0mm-20mm | |
脱模Substrate Separation |
脱模速度:0.1-20mm/s Speed:0.1mm/sec-20mm/sec | |
脱模距离:0mm- 3mm Distance:0mm- 3mm | ||
脱模方式Separation option |
先起刮刀再脱模,先脱模再起刮刀 Separation after squeegee up;Squeegee up after separation |
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适用浆料Apply paste option | 锡膏,油墨,银浆solder paste,printing ink,silver paste |
智能传输系统Transfer System 规格Specification | ||
皮带类型Belt Type | U型齿轮皮带,前轨道固定Ugear belt,front rail fixed | |
ESD兼容性ESD Compatibility |
黑色运输皮带和导轨的表面电阻率>110Ω Black transport belts and guides with surface resistivity of greater than 110 Ω |
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宽度调整Width Adjustment | 程式可调后轨道移动Programmable motorized rear rail | |
运输方向Transport Direction | L→R,L→L,R→L,R→R | |
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最小基板尺寸Substrate Handling Size(minimum) | 50mm(X)x50mm(Y) |
最大基板尺寸Substrate Handling Size(maximum) | 400mm(X)×340mm(Y) | |
基板厚度Substrate Thickness | 0.4mm-5 mm | |
基板重量Substrate Weight(maximum) | ≤3kg | |
基板翘曲量Substrate Warpage | ≤对角线1%≤1%diagonal | |
基板固定Substrate Fixture | 柔性侧夹Flexible side clamp | |
基板下方净空高度Substrate Underside Clearance | ≤15mm |
识别系统Vision 规格Specification | ||
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多功能图像处理系统 Multi function image process system |
Mark点软件测量,二次定位,组件识别功能,数字相机:130万像素,相机景深达2mm, FOV:10*8mm Fiducial Mark software measurement,twice position,device identification function,Digital camera:1.3 millian pixels,the camera scene depth 2mm FOV:10*8mm |
图像定位系统Fiducial Recognition |
自动对准示教,最小识别0.1毫米的基准点 Automatic fiducial teach and find incorporating 0.1mm fiducial capture |
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基准点数量Fiducials | 2个或4个mark基准点定位系统Two or Four Fiducial Marks Alignment System |
基准点类型Fiducial Types |
□方形,○圆形,△三角形,+十字形,用户自定义类型 □ square,O round,△ triangle,+cross,user-defined types |
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基准点尺寸Fiducial Size | 0.1mm~3mm | |
基准点位置FiducialLocations | 基板上任意位置Anywhere on substrate | |
基准点位置补偿Fiducial Error Recovery | 自动光学调整Auto lighting adjustment | |
基准点自动搜寻Auto fiducial search | ||
相机光源Camera Lighting | 手动调节Manual adjustment | |
2D检测系统2D inspect system | 2D检测锡膏印刷品质2D detect solder printing quality |
电 气 配 置 及 环 境 要 求 规格Specification | ||
电 压 V o l ta g e | 电压:220V,±10%,单相50/60Hz.220Volts +/-10%.Single phase 50/60Hz | |
功 率 P o w e r | 2kw | |
气源Air Supply | 0.45-0.6kg/cm² | |
温度Temperature | 25±3℃ | |
湿度Humidity | 相对湿度30%-70%30%-70%relative humidity (non condensing) |
标准配置Standard Configuration 规 格Specification | ||
印刷机框架Printer Construction | 整机一体成型框架One piece optimized welded frame | |
设备控制Machine Control | 三块运动控制卡控制Three control motion control card | |
操作系统Operation System | Windows XP,可选配Win7 Windows XP,Win7(option) | |
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操作界面Operator Interface |
显示屏,键盘和鼠标,DESENV2软件,显示器放在设备右侧顶上. Display screen,keyboard and mouse and DESEN V2 software, display on the right hand side. |
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刮刀Squeegee | 直连丝杆/单点悬浮式刮刀Direct screw/single-point suspension squeegee |
刮刀压力恒定智能控制系统Constant intelligent control system of squeegee pressure |
软件设置调整刮刀压力 Pressure adjusted by software control |
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钢网自动定位模块 Automatic positioning module of stencil |
钢网放入钢网支撑架中,刮刀头自动实现钢板定位 Put the stencil into the support frame,the squeegee automatically realizes the positioning of the stencil |
基板支撑定位系统PCB Support positioning system | 支撑等高块,支撑pin,支撑平台Support block,support pin,support platform | |
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智能清洗系统Intelligent cleaning system |
多尺寸擦拭纸通用,擦拭纸耗量少,清洗剂控制模块 The diffrent size of wipe paper can be used ,less paper consumption,solvent agent control module |
网板定位Stencil Alignment | 程序设定,Y向定位Program control,Y direction orientated | |
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设备接口Machine Interface |
SEMI Input/Output 4芯国际标准接口 SEMIInput/Output 4 core international standard interface |
通讯接口Connectivity |
RJ-45LAN(网络)和USB2接口可用 RJ-45LAN(networking)and USB2 interface available |
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三色智能LED警示灯 Three color intelligent LED warning light |
可编程控制和声光报警Programmable with audible alarm | |
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高性能高精度平台 High performance and high precision platform |
平台处理方式采用退火工艺+小刀快铣方式,减少平台内金属应力残留,长期使用后不 易变形,精度保证. The platform processing method adopts the annealing process and the knife quick milling method,and the residual of the metal stress in the platform is reduced.Easy deformation,precision assurance. |
快捷式平台调整系统 Fast platform adjustment system |
旋钮式手动快速调整平台高度 Knob type manual rapid adjustment platform height |
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智能补偿平台 Intelligent compensation platform |
X,Y,θ多轴独立调整 X,Y,θ multi axis independent adjustment |
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智能传输系统Intelligent transmission system |
自动停板装置+自动基板定位+左进左出,左进右出,右进右出,右进左出 The automatic limit device +automatic positioning substrate +left into the left, the left into the right,rightinto the right,right into the left out |
说明书Documentation |
硬拷贝手册包括:Opeartor,安装和电气图纸. 技术手册和教程上支持操作符的功能. Hard copy manuals comprising:Opeartor,Installation,and Electrical Drawings. On board technical manuals and tutorials supporting operator functions. |
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设备尺寸Approximate Dimensions | 1140(长)X1365(宽)X1510(高)mm 1140(L)X1365(W)X1510(H)mm | |
设备重量Approximate Weight |
1300kg含包装(设备本身+配置选项) 1300kg boxed(dependent upon configured options selected with machine) |
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1100kg不含包装(设备本身+配置选项) 1100kg unboxed(dependent upon configured options selected with machine) |
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软件与通信Software &Communications 规格Specification | |
软件智能备份模块 Software intelligent backup module |
数据库自动备份,软件升级后不丢失 Database automatic backup,software upgrade is not lost |
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保养预警功能Maintenance early warning function |
机台丝杆,滑块,电机等自动提示保养讯息 Machine wire rod,slide block,motor and other automatic maintenance message |
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印刷参数智能模块 Printing parameter intelligent module |
选择生产基板类型,自动给出最优的参数设置 Customer select the type of production,like FPC,LED,Phone PCB...the printer can give the parameter automatically. |
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锡膏自动回收系统 Recovery system of solder paste |
定时或定次数软件控制刮刀将印刷行程外的锡膏回收到印刷行程中 The fixed frequency to recovery the solder paste into the printing area. |
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认证Certification | 规格Specification | |
CE | 98/37/EC,89/336/EEC,73/23/EEC | |
噪音级Acoustic Noise Level | <70dB Less than 70dB |