Send Message
YUSH Electronic Technology Co.,Ltd
products
products
Home > products > PCB Cutting Machine > 2.4KW 60000rpm Wafer Cutting Machine For PCB

2.4KW 60000rpm Wafer Cutting Machine For PCB

Product Details

Place of Origin: China Dongguan

Brand Name: YUSHUNLI

Certification: CE

Model Number: SDS1000

Payment & Shipping Terms

Minimum Order Quantity: 1set

Price: USD1000~40000

Packaging Details: plywooden case

Delivery Time: 5-7work days

Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability: 200Sets/Month

Get Best Price
High Light:

2.4KW Wafer Cutting Machine

,

60000rpm Wafer Cutting Machine

,

220V PCB Cutting Machine

Cutting Speed:
0.05 ~ 400mm/sec
Resolution:
0.0001mm
Repeat Positioning Accuracy:
0.001 / 310mm
Angle Of Rotation:
360 Deg
Speed:
5,000 ~ 60,000rpm
Power Supply:
3P , 220 (50 ~ 60 Hz)V
Machine Power:
4KW
Power Air Pressure:
0.5 ~ 0.6 MPa
Air Consumption:
200 L/min
Cutting Speed:
0.05 ~ 400mm/sec
Resolution:
0.0001mm
Repeat Positioning Accuracy:
0.001 / 310mm
Angle Of Rotation:
360 Deg
Speed:
5,000 ~ 60,000rpm
Power Supply:
3P , 220 (50 ~ 60 Hz)V
Machine Power:
4KW
Power Air Pressure:
0.5 ~ 0.6 MPa
Air Consumption:
200 L/min
2.4KW 60000rpm Wafer Cutting Machine For PCB
2.4 KW Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
 
Features of products
 
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
•Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm)
•Repeat positioning accuracy : 0.001mm
•Cutting speed: 0.05 ~ 400 mm/sec
•Standard collocation of using blade size:2 Inch (Max:3 Inch)
• CCD automatic align.
• Real-time monitoring system of air pressure, water pressure,current, etc., to avoid damage to the air spindle.
 
x-axis
Working stroke
340MM
cutting speed
0.05 ~ 400mm/sec

resolution

0.0001MM

 

y-axis
Working stroke
310MM
resolution
0.0001MM
Repeat positioning accuracy
0.001 / 310MM

 

z-axis
Working stroke
60 (2 InchBlade)mm
resolution
0.0001mm

 

 

Θ-axis
Angle of rotation
360deg
Specifications:
Dimensions of processing
Φ300mm
Dimensions of working platform
Φ350mm
power
2.4KW
speed
5,000 ~ 60,000 rpm
power supply
3P , 220 (50 ~ 60 Hz)v
Power air pressure
0.5 ~ 0.6 MPa
Air consumption
200L/min
Cutting water consumption
4.0L/min
cooling water consumption
1.5L/min
(W×D×H) physical dimension
1040×1080×1750mm
machine net weight
850KG

 

Features of products

 

• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
 
• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed
 
• Can meet the high precision cutting maximum diameter of 300 mm materials.
 
• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
 
2.4KW 60000rpm Wafer Cutting Machine For PCB 0
2.4KW 60000rpm Wafer Cutting Machine For PCB 1