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Home > products > Selective Soldering Machine > SMT E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine

SMT E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine

Product Details

Place of Origin: jiangsu

Brand Name: Yushunli

Certification: CE, RUV Rheinland (China), GMC(GlobalMarket),ISO9001-2000

Model Number: YS-E46

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: USD 6500~108000

Packaging Details: Plywooden case

Delivery Time: 3 days to 7 days

Payment Terms: T/T ,Paypal ,West Union ,L/C ,D/P .

Supply Ability: 300 sets/ month

Get Best Price
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Cell Phone Automatic Soldering Machine

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PCB Soldering Machine

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SMT E Selective Soldering System

Dimension(L*W*H):
1900 * 1740 * 1665 (mm)
PCB Size:
L340 * W460 (mm)
Conveyor Height:
900±20mm
Solder Pot:
Electromagnetic Pump Tin Solder Pot
Theamountof Tindross:
0.5KG/ Pot/week X 2
Nitrogen Consumption:
1.5 - 2m³/h/ Pot X 2
Dimension(L*W*H):
1900 * 1740 * 1665 (mm)
PCB Size:
L340 * W460 (mm)
Conveyor Height:
900±20mm
Solder Pot:
Electromagnetic Pump Tin Solder Pot
Theamountof Tindross:
0.5KG/ Pot/week X 2
Nitrogen Consumption:
1.5 - 2m³/h/ Pot X 2
SMT E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine

E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine

 

Product Description

SMT E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine 0

 

Equipment parameters Dimension (LxWxH) 1900 x 1740 x 1665 (mm)
Transport Parameters Transport width adjustment 50 - 460 (mm)
  PCB size L340 * W460 (mm)
  Conveyor height 900±20(mm)
Thesolderingsystem Solder pot Electromagnetic pump tin soldepot
  solder pot numbers single pot Dual pots St ove 2
  solder pot numbers 0.5KG/ pot/ week x1 0.5KG/ pot / week x2
  Nit rogenconsumption 1.5- 2m³/h/pot x 1 1.5 - 2m³/h/pot x2

FLUX SPRAY MODULE

Introduction:
The spray head which is imported from Germany offers an absolutely precise and
well defined flux deposition on even the smallest areas. The flux is targeted to be
applied only to the solder joint,whereby the wettable area can be as small as 3
mm.with the effect that ionic contamination is minimized and flux consumption is
duced.

Features:
Saving 90%flux compared to traditional mode.
The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free.
Two axis servo motor control, high positioning accuracy.
Minimum ionic contamination.

 

Specifications:
 
Flux module x axis distance (max.)
510mm
Flux module y axis distance (max.)
450mm
Max. nozzle speed
7m/min
Flux content
2 L
Flux type
RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1
Flux effective level
L0, L1, M0
Nozzle
130 μm, alternative diameter
Spray pressure
0.5~1.0 bar
Spray width
2~8 mm (with spray nozzle 130 μm)
Spray speed
20 mm/s
Positioning speed
400 mm/s
Positioning accuracy
±0.2 mm
Flux system
2-axis With Servo Drive

 

PREHEATING MODULE

Introduction:
The current selective soldering processes, in particular those for lead-free soldering,
multi-layer boards or high mass components, call for increased preheat capacities.
Short wave IR heater on the bottom and hot air convective preheating on the top, to
ensure preheating evenly.

Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).

 

Specifications:
Top heater power
4KW
Top heater voltage
220V
Bottom heater powerr
4.8KW
Bottom heater voltage
220V
CDA pressure
0.5-0.7MPa

 

SOLDERING MODULE

Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.

Specifications:
Solder nozzle position
Middle
Solder content
13 Kg
Max. soldering temperature
350 °C
Min. internal diameter of solder nozzle
3 mm, External Diameter 4.5 mm
Max. Solder wave height
5 mm
Soldering speed X,Y-axis
10 mm/s
Positioning speed X,Y-axis
200 mm/s
Positioning speed Z-axis
100 mm/s
Positioning accuracy
±0.15 mm
Max.solder distance(x axis)
510mm
Max.solder distance(y axis)
460mm
Max.distance of z-axis
58mm
Max.pot moving speed
5.8m/min
Control system
3-axis With Servo Drive

 

 

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SMT E Selective Soldering System PCB Soldering Machine Provided 220V Cell Phone Automatic Soldering Machine 1

 

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