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Home > products > Laser Depaneling Machine > FR4 Board Laser Depaneling Machine ±20 μM Precision / 450*430 Mm 15W 2500mm/s (max) UV PCB Separator /

FR4 Board Laser Depaneling Machine ±20 μM Precision / 450*430 Mm 15W 2500mm/s (max) UV PCB Separator /

Product Details

Place of Origin: Jiangsu

Brand Name: YUSH

Certification: CE

Model Number: YSATM-3L

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: 1000

Packaging Details: Wooden case

Delivery Time: 10 days

Supply Ability: 100/ month

Get Best Price
High Light:

pcb depaneling machine

,

cnc drilling machine

Working Size::
450*430 Mm
Precision::
±20 μm
Laser Wavelength::
355nm
Laser Power::
15W(optional)
Type::
UV
Laser Brand::
USA Or Germany
Laser Scanning Speed::
2500mm/s (max)
Working Size::
450*430 Mm
Precision::
±20 μm
Laser Wavelength::
355nm
Laser Power::
15W(optional)
Type::
UV
Laser Brand::
USA Or Germany
Laser Scanning Speed::
2500mm/s (max)
FR4 Board Laser Depaneling Machine ±20 μM Precision / 450*430 Mm 15W 2500mm/s (max) UV PCB Separator /

Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards

 

PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

FR4 Board Laser Depaneling Machine ±20 μM Precision / 450*430 Mm 15W 2500mm/s (max) UV PCB Separator / 0

 

Laser Depanelizer Machine,YSATM-3L Feature:

1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3. Reduce energy consumption, Cost savings.

4. Cost-effective, fast cutting speed, stable performance

 

FR4 Board Laser Depaneling Machine ±20 μM Precision / 450*430 Mm 15W 2500mm/s (max) UV PCB Separator / 1

 

Laser Depanelizer Machine, YSATM-3L Specification:

 

Parameter

 

 

 

 

 

 

 

 

Technical parameters

Main body of laser 1480mm*1360mm*1412 mm
Weight of the 1500Kg
Power AC220 V
Laser 355 nm
Laser

 

Optowave 10W(US)

Material ≤1.2 mm
Precisio ±20 μm
Platfor ±2 μm
Platform ±2 μm
Working area 600*450 mm
Maximum 3 KW
Vibrating CTI(US)
Power AC220 V
Diameter 20±5 μm
Ambient 20±2 ℃
Ambient <60 %
The Machine Marble

Laser Depanelizer Machine Principle

 

FR4 Board Laser Depaneling Machine ±20 μM Precision / 450*430 Mm 15W 2500mm/s (max) UV PCB Separator / 2