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Home > products > PCB Cutting Machine > Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD

Product Details

Place of Origin: JiangSu

Brand Name: YUSH

Certification: CE Mark

Model Number: YSL-2000AD

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: business negotiation

Packaging Details: wooden package

Delivery Time: 3 days to 7 days

Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability: 25 Set/Sets per Month

Get Best Price
High Light:

Dicing PCB Board Cutting Machine

,

60000Rpm PCB Board Cutting Machine

,

Auto Dicing PCB Cutting Machine

Dimensions Of Processing:
300mm
Power:
2.4*2 Set KW
Speed:
5000-60000Rpm
Machine Power:
8KW
Power Air Pressure:
0.6 ~ 0.68 MPa
Standard Collocation Of Using Blade Size:
2 Inch(Max:3 Inch)
Dimensions Of Processing:
300mm
Power:
2.4*2 Set KW
Speed:
5000-60000Rpm
Machine Power:
8KW
Power Air Pressure:
0.6 ~ 0.68 MPa
Standard Collocation Of Using Blade Size:
2 Inch(Max:3 Inch)
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD
Basic Description
The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 0
 
Operation procedures
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 1
 
Wafer or Strip      Tape mounting         Dicing                Cleaning                UV seperation
 

Description of Auto dicing

Auto-dicing system, refers to a dicing system which all using full automatic operation from a series of processes of feeding, position calibration, cutting, cleaning / drying and unloading.
 
Main procedures
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 2

 

    Feeding               Position align         Auto-dicing           cleaning /drying     Unloading automatically
automatically
 
1. Remove the dicing material automatically and transfer to the working platform from the magazine .

2.The dicing position align automatically.

3. Complete the dicing process of material automatically .

4. Use pure water and compressed air to clean and dry the dicingmaterial.

5. Sent the dicing material automatically to the magazine .

 

Applications

Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 3
          Ceramic substrate                      Silicon rubber                                Lead frame
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 4
 
                  Silicon wafer                                     PCB                                             Glass
 
Operating Requirements
1. Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
2. Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.

3. Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).

4. Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

5. Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

6. Please follow the product manual we provided for operation strictly.

 

Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 5

 

Full Auto Dicing System YSL-2000AD Features of products

1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.

2. Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
3. Can meet the high precision cutting maximum diameter of 300 mm materials.
4.Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
5.CCD automatic align.
6.Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
7.Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
8.Repeat positioning accuracy : 0.001mm
9.Cutting speed: 0.05 ~ 400 mm/sec
10.Each magazine can be stored 20 ~ 30 layers of frame.
11.Standard collocation of using blade size: 2 Inch(Max:3 Inch)
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 6
 
Processdescription
1.Mechanism remove it from magazine, and send it to the temporary table.
2.Unloading robot will move the dicing material tochunk.fordicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporarytable.
5.Robot send the dicing material to the magazine .
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 7
 
Case Sharing
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 8

 

System compositionproject Unit Specification
Dimensions of processing mm Φ300
Dimensions of working platform mm Φ350
X-axis Working stroke mm 500
Cutting speed mm/sec 0.05 ~ 400
Resolution mm 0.0001
Y-axis Working stroke mm 650
Resolution mm 0.0001
Repeat positioning accuracy mm 0.001 / 310
Z-axis Working stroke mm 60 (2 Inch blade)
Resolution mm 0.0001
Θ-axis Angle of rotation Deg 360
Spindle Power KW 2.4*2 set
Speed Rpm 5000 ~ 60000
Machine’s specifications Power supply V 3P 220 (50 ~ 60 Hz)
Machine power KW 8
Power air pressure MPa 0.6 ~ 0.68
Air consumption L/min 250
Cutting water consumption L/min 6.5
Cooling water consumption L/min 2.5
Physical dimension mm 1262*1704*2023
Machine net weight KG 1900


Other Discription 

Optional equipment
1.Function of blade damage detection;
2.Automatic setting function;
3.Dicing visual function;
4. Using dicing blade with 3 Inch.
 
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 9
 
Ordinary 8 inch working platform can only put 2pcs material.
SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
 
Glass Ceramic Semiconductor Chip PCB Board Cutting Machine Full Auto Dicing YSL-2000AD 10
 
1.Reduce the loading times;
2.Meet the larger size of the product;
3.Promote more than 8% efficiency.