Payment & Shipping Terms:
|Max. Working Area:||300 Mm X 300 Mm X 11 Mm||Max. Recognition Area:||300 Mm X 300 Mm|
|Data Input Formats:||Gerber, X-Gerber, DXF, HPGL,||Max. Structuring Speed:||Depends On Application|
|Positioning Accuracy:||± 25 μm (1 Mil)|
UV Laser PCB laser depaneling . FPC laser depaneling equipment. Printed Circuit Board Laser Depaneling Machine
Laser Depaneling of Printed Circuit Boards (PCBs)
This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.
Compared to conventional tools, laser processing offers a compelling series of advantages.
Processing Flat Substrates
UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. It is optimized for these work steps.
The model seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.
|Max. working area (X x Y x Z)||300 mm x 300 mm x 11 mm|
|Max. recognition area (X x Y)||300 mm x 300 mm|
|Max. material size (X x Y)||350 mm x 350 mm|
|Data input formats||Gerber, X-Gerber, DXF, HPGL,|
|Max. structuring speed||Depends on application|
|Positioning accuracy||± 25 μm (1 Mil)|
|Diameter of focused laser beam||20 μm (0.8 Mil)|
|Laser wavelength||355 nm|
|System dimensions (W x H x D)||1000mm*940mm
|Weight||~ 450 kg (990 lbs)|
|Power supply||230 VAC, 50-60 Hz, 3 kVA|
|Cooling||Air-cooled (internal water-air cooling)|
|Ambient temperature||22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
|Humidity||< 60 % (non-condensing)|
|Required accessoires||Exhaust unit|