Digital Solder Paste Printer - GSE Automatic Vision Screen Soldering Paste Printer ( Model:GSE )
Specification parameters:
| Item No | X9 |
| PCB Parameters | |
| Maximum board size (X x Y) | 450mm x 350mm |
| Minimum board size (Y x X) | 50mm x 50mm |
| PCB thickness | 0.4mm~14mm |
| Warpage | Max. PCB Diagonal line 1% |
| Maximum board weight | 10kg |
| Board margin gap | Configuration to 3mm |
| Maximum bottom gap |
20mm |
| Transfer speed | 1500mm/s(MAX) |
| Transfer height from the ground | 980 ±40mm |
| Transfer orbit direction | Left-Right , Right-Left, Left-Left, Right-Right (Program Settings) |
| Transfer mode | One stage orbit |
| PCB clamping method |
Programmable flexible side pressure + Adaptive PCB board |
| Support method |
Magnetic thimble, equal high block, vacuum suction cavity, special |
| Printing parameters | |
| Printing head | Suspended intelligent closed loop printing head (Linear motor) |
| Template frame size | 370mm x 470mm~737 mm x 737 mm |
| Maximum printing area | 450mm x 350mm |
| Squeegee type |
Steel squeegee / Glue squeegee (angle 45°/55°/60°matching the |
| Squeegee length | 220mm~500mm |
| Squeegee height | 65 ±1mm |
| Squeegee thickness | 0.25mm Diamond-like carbon coating |
| Printing mode | Single or double squeegee printing |
| Demoulding length | 0.02 mm - 12 mm |
| Printing speed | 0~ 200 mm/S |
| Printing pressure | 0.5- 10Kg |
| Printing stroke | ±200mm From the center |
| Image parameters | |
| Field of View | 6.4mm x 4.8mm |
| Platform adjustment range | X,Y: ±7.0MM, θ:±2.0° |
| Benchmark point type |
Standard shape benchmark point (SMEMA standard), solder pad / |
| Camera system |
Independent camera, upwards / downwards imaging vision system, |
| Performance parameter | |
| Repetition precision of image calibration | ±10.0 micron @6 σ,Cp≥2.0 |
| Repetition precision of printing | ±20.0 micron @6 σ,Cp≥2.0 |
| Cycle time | < 7s |
| Product Changeover | < 5mins |
| Equipment | |
| Power requirements | AC220V ±10%,50/60HZ,15A |
| Compressed air requirements | 4~6Kg/cm2, 10.0 Diameter of the tube |
| Operating system | Windows XP |
| External dimension | L1140x W1410x H1480mm |
| Machine weight | Around1000Kg |
| Temperature and humidity control module (optional) | |
| Environment temperature | 23±3℃ |
| Relative humidity | 45~70%RH4 |
Feature and function
Printer 3M Solder Paste Printer, since it’s simple and reliable structure, accurate positioning and easy to adjust, thereby it can quickly and automatically adjust the pin height for the different thickness of PCB.
The spray nozzle makes the cleaning liquid evenly sprinkled on the wiping paper. The arc-shaped rubber wiper is soft, antiwear and antirust, cleaning thoroughly with the bidirectional strong vacuum.
It’s easy to adjust the width of the wiping paper from 250 to 450mm, and can be used for dry cleaning, wet wiping, wet cleaning, reciprocating cleaning or other purposes.
Accurate optical positioning system
Advanced upper/lower coaxial optical alignment system with omni-directional light compensation, clear resolution, wide range of process application window, high precision servo motor and the combination of the most advanced ball screw and linear slide rail for more accurate recognizing and capturing the images.
The outstanding stability can ensure the coincident accuracy of PCB and stencil.
Zero pressure feedback protection system
With the squeegee pressure feedback system, we can intelligently adjust the depth of the squeegee and ensure the pressure value invariably in printing process,there by to achieve the best process control for the perfect printing of high-density and fine pitch devices.
The pressure data measured in real time, it can be used for the statistic and monitoring of process control.
High efficiency and high adaptability stencil cleaning system
Siphonic and programmable atomizing nozzle and cleaning fluid can be any combination of dry, wet and vacuum cleaning methods for cleaning thoroughly.
The soft antiwear rubber squeegee is easy to disassemble and cleaning thoroughly.
2D solder paste printing quality inspection and SPC analysis
The 2D function can quickly detect the defects such as offset, less tin, missed printing, and even tin, and the detection points are arbitrarily increased. The SPC software can analyze the CPK index of the machine through the samples collected by the machine to ensure the printing quality.
Our products are sold all over the world, you can rest assured.
